1. The equipment is mainly used for dismantling and welding the surface mount of electronic components Such as: SOIC, CHIP, QFP, PLCC, BGA, etc.
2. Used for disassembly and welding of mobile phone wiring and wiring holder.
3. It can be used for heating, drying, removing paint, removing glue, thawing, bonding, thermal testing and other processes that need heating for heat shrinkable hose and various plastics.
II . Packing List Attachment:
After receiving this product, please open the package and check whether the following basic accessories are missing. There are many types of welding table, different types of accessories will increase or decrease, please consult with local vendors.
Ⅲ . Product performance description
1. This equipment adopts resistance wire heating, K-type thermocouple sensing closed loop microcomputer PID full program temperature control. It has advanced prediction, accurate temperature control, multiple fault indication and safety protection measures. Temperature constant temperature accuracy is not more than ±2 degrees, linear distortion <±3 .
2. Air volume air supply adopts high-performance double ball vortex fan, which has the characteristics of low noise, light weight, large air volume, high wind pressure, long service life and so on. Air volume size can be adjusted, air volume adjustment range: 5%-100%.
3. The handle is fitted with an induction switch and can be removed from the bracket to quickly enter the working mode. When the handle is placed in the handle holder, the system will cool down and send cold air to the standby state. Real-time operation is convenient, save less energy loss and prolong
